Search Results - Semiconductors%2c+Materials+%26+Processes

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  1. Invention Description The push for smaller, more efficient, and high-performance power electronics systems is fueling the rapid adoption of Wide Bandgap (WBG) and Ultrawide Bandgap (UWBG) semiconductors. Compared to traditional silicon (Si), these advanced materials allow devices to operate at higher voltages, faster switching frequencies, and elevated...
    Published: 3/31/2026
    Inventor(s): Chanyeop Park, Omar Faruqe
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  2. Invention Description Both the generation of highly controlled electron beams and the visualization of optical modes in integrated photonic structures remain important challenges in modern nanoscience and photonics. Conventional photoemission sources operate in reflection or transmission geometries where light propagates perpendicular to the emitting...
    Published: 3/9/2026
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  3. Invention Description Ultrawide bandgap materials (UWGP) like Ga₂O₃, diamond, and aluminum nitride (AlN) are promising for next generation high voltage, high temperature electronics due to their superior properties. AlN with its wide 6.2 eV bandgap and high 12 MV/cm breakdown field, is particularly attractive for high power applications. However, its...
    Published: 2/26/2026
  4. Invention Description The demand for advanced thin-film deposition techniques has grown substantially in recent years, driven by the development of next-generation electronic, optoelectronic, and energy devices. Traditional deposition methods, such as chemical vapor deposition, molecular beam epitaxy, and physical vapor deposition, have well-established...
    Published: 2/26/2026
    Inventor(s): Feng Yan, Lin Li
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  5. Invention Description The semiconductor industry has long relied on thermoset polymers for their superior thermal and mechanical stability in advanced packaging applications such as capillary underfills (CUFs), molded underfills (MUFs), and over-mold compounds. However, as devices evolve toward complex multidie 2D, 2.5D, and 3D architectures, traditional...
    Published: 2/26/2026
    Inventor(s): Yoan Simon
  6. Invention Description Perovskite solar cells (PSCs) have been rigorously researched and pursued as a potential low-cost, next-generation thin-film photovoltaic technology. PSCs have now achieved certified power conversion efficiencies (PCEs) exceeding 26%, which paves the way to commercial upscale manufacturing. However, the commercialization of PSCs...
    Published: 2/26/2026
    Inventor(s): Feng Yan, Jacob Wall
  7. Invention Description Gallium Nitride (GaN) is a wide bandgap semiconductor that has gained significant attention in recent years specifically for use in RF and power electronics due to its excellent material properties and better performance compared to traditional silicon (Si) devices. GaN based lateral high electron mobility transistors (HEMTs)...
    Published: 2/26/2026
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  8. Perovskite materials, especially hybrid metal halide perovskite (MHP), have garnered significant attention because of their potential in the field of solar cells. However, the further development of perovskite materials has been plagued by their stability challenges. Because of the “soft” ionic nature of the lattice while being brittle and...
    Published: 2/26/2026
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  9. The industry of perovskite materials has been highly sought out for next generation technology and devices. Perovskite thin films have been used in a large array of applications including light-emitting diodes (LEDs), solar cells, lasers and photodetectors. However, within recent years the widely existing defects (from significant intrinsic point defects...
    Published: 2/26/2026
    Inventor(s): Jian Li
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  10. -collapse: collapse; } Solid-state nanopores are attractive because of their low cost and broad potential utility from single-molecule bioanalytical sensing to diagnostics and sequencing of DNA and protein molecules. Unfortunately, conventional use of conductive silicon substrates results in high capacitive noise, significantly limiting sensing accuracy...
    Published: 2/26/2026
    Inventor(s): Chao Wang, Pengkun Xia
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