Background Additive manufacturing has contributed to the growth of technology to fabricate structures that have enhanced performance in a wide range of applications. One example family of these structures is cellular, or meta-materials, which include honeycombs, foams, and lattices. These materials enable novel properties that exploit the nature of...

­Background Nanoparticle-based metallic powders are of interest for rapid sintering, thermal bonding, and electrically conductive metal pastes due to its unique properties, such as lower sintering temperature compared to bulk counterparts and efficient light absorption for photonic curing. However, there are some drawbacks associated with the production,...

Invention Description The reliability of microelectronic packaging is increasingly challenged by the phenomenon of electromigration in lead-free solder joints, where high current densities cause material transport and eventual failure. Traditional characterization methods, such as optical and scanning electron microscopy, are restricted to two-dimensional...