Background Metallic films are commonly used as interconnects in semiconductor devices, flexible electronic devices, and micro-electronic-mechanical systems (MEMS). These applications typically require good mechanical (e.g., high strength) and electrical (e.g., low resistivity) properties. Nanocrystalline or nanolaminate films are commonly used, and...

Background Metallic glass (amorphous) films have superior hardness, wear, and corrosion resistance as well as lower roughness compared to crystalline metallic films. These superior properties arise because of the lack of crystal defects and grain boundaries in metallic glass films. Metallic glass films have numerous applications in biomedical devices,...

Background Conventional copper (Cu) interconnects in integrated circuits show significant increases in line resistivity when linewidths decrease below 10 nm. This is due to two reasons: First, scattering of electrons at the interfaces becomes predominant since the linewidth is considerably smaller than the electron mean free path (EMFP) in Cu. Second,...

Background Nitinol (NiTi) is a nickel titanium alloy that has shape memory features, and can recover its initial shape after deformation upon heating. NiTi has a large recoverable strain and high work output, making NiTi films an ideal choice for sensors and actuators in MEMS devices. However, the thermal shape memory effect in NiTi is suppressed when...

Background Metallic films have a broad range of applications in electronics, optoelectronics, plasmonics, catalysis, and MEMS sensors and actuators. In many of these applications it is highly desirable to control the microstructure (size and spatial distribution of grains, texture, and phase composition) of the films since the microstructure largely...

Background Thermal barrier coatings (TBCs) are used to protect structural alloys in extreme (temperature/stress/radiation) environments (e.g., space reentry/hypersonic vehicles, aero turbines). Porous ceramics are often used as the topcoat of TBCs because of their high strength and melting point, and low thermal conductivity. However, ceramic topcoats...

The processes of Hydrosilylation or Hydrogenation are widely used in the manufacturing of silicone-based materials and as a precursor in pharmaceuticals. These materials include coatings, adhesives, sealants, and cured rubbers. These processes rely on the use of metal catalysts. Unfortunately, these catalysts are relatively toxic, rare, and are very...

Background Increased material strength and ductility are almost universally desired. However, a well-known tradeoff between the two parameters exists: Strong materials (such as ceramics) are typically brittle, while ductile materials (such as metals and metallic alloys) generally exhibit low to moderate strength. Efforts to overcome this strength-ductility...

Nanocrystalline alloy coatings prevent oxidation and corrosion while improving a material’s electrical or mechanical properties. While nanocrystals provide significant advantages in performance, they often become unstable if subjected to heat or stress and lose their benefit as they merge and the crystals grow larger. The grain boundaries between...