In the manufacture of semiconductor devices, the substrate, usually Silicon, is oxidized to form an oxide layer at the surface prior to device fabrication. This oxide layer (such as SiO2 grown on a Si (100)) surface typically grows completely amorphous with little ordering in the first atomic layers near the interface. This can lead to thickness and...

Currently, the fabrication of semiconductor devices requires immensely complicated procedures, performed on high quality materials, under extreme conditions. Consequently, the semiconductor industry is constantly looking for improved methods of and superior materials for device fabrication. Researchers at Arizona State University have nucleated and...