Background As the semiconductor industry continues to make new advances in material development, the synthesis of photoreversible polymers for bond-debond applications is of particular interest. These materials typically have strong adhesive properties in the semiconductor manufacturing process, but adhesive strength can effectively be turned off using...

Background Recent innovations in semiconductor technology require a range of novel materials capable of supporting technically challenging patterning processes. These materials must meet diverse thermomechanical and optical requirements needed for multi-step fabrication processes. These properties include thermal expansion coefficients, thermal stability,...

Background Bismaleimides (BMIs) and acrylates are key monomers in polymer science, valued for their thermal stability, mechanical properties, and reactivity. They are widely used in high-performance applications including aerospace and 3D printing. However, their current applications are mostly limited to polymeric matrices for thermosets and thermoplastics....