Invention Description Heterogeneous composite materials, such as ceramic matrix composites (CMCs), are increasingly employed in high-temperature and extreme-environment applications due to their superior specific strength, thermal stability, and damage tolerance. The macroscopic response of these materials is governed by complex interactions among...

Invention Description Additive manufacturing (AM) can transform the production of engineered components, offering performance advantages over traditional methods. Metallic cellular materials produced by AM are of growing interest for aerospace, biomedical, and automotive applications due to their lightweight and multifunctional nature. Fatigue life...

Invention Description In modern airtight vehicles, the concentration of air pollutants, including CO2, can build up quickly, with some studies showing a rise above 2500 ppmv of CO2 in mere minutes in occupied vehicles. This is particularly noticeable during recirculated air operation and in urban or hot climates where cabin air is recirculated to enhance...

Invention Description Ultrawide bandgap materials (UWGP) like Ga₂O₃, diamond, and aluminum nitride (AlN) are promising for next generation high voltage, high temperature electronics due to their superior properties. AlN with its wide 6.2 eV bandgap and high 12 MV/cm breakdown field, is particularly attractive for high power applications. However, its...

Invention Description The demand for advanced thin-film deposition techniques has grown substantially in recent years, driven by the development of next-generation electronic, optoelectronic, and energy devices. Traditional deposition methods, such as chemical vapor deposition, molecular beam epitaxy, and physical vapor deposition, have well-established...

Invention Description The semiconductor industry has long relied on thermoset polymers for their superior thermal and mechanical stability in advanced packaging applications such as capillary underfills (CUFs), molded underfills (MUFs), and over-mold compounds. However, as devices evolve toward complex multidie 2D, 2.5D, and 3D architectures, traditional...

Invention Description There is a well-recognized need to broadly decrease the amount of water used for evaporative (wet) cooling in many applications, especially in power generation, but also in emerging cutting-edge technologies, such as data and supercomputing centers. The main challenge in dry cooling using ambient air is the inevitable temperature...

Invention Description Crystalline silicon (c-Si) photovoltaic (PV) panels contain a mix of bulk materials (such as glass, silicon, and aluminum), toxic substances (like lead, tin, and copper), and precious metals. Due to solar panel designs not being standardized, their compositions vary. Panels with lead-based solder, for example, contain more lead...

Invention Description Solar cell fabrication requires the use of transparent conductive oxides on the front face (sun facing side) and rear contact to provide a current path for operation. Typically, only one layer of Indium Tin Oxide is sputtered from an alloy composition target, Researchers at Arizona State University have developed a technology...

Invention Description Functionally graded materials (FGMs) offer the ability to create structures with spatially varying properties, enabling advanced performance in applications such as biomedical devices, soft robotics, and high-performance composites. However, existing multi-material 3D printing systems, such as stereolithography, are often slow...